With four functional groups, high crosslinking density and aromatic ring density can be formed during curing, especially in high temperature resistance and humidity resistance.
Field:
High temperature resistant adhesive; High temperature resistant carbon fiber, glass fiber composite materials; Pouring seal for micro motor components; Electrical insulation materials, etc
Usage method:
DDS, methyl nadedic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, alicyclic amine, isocyanate, etc. Cured Tg can reach 230~280℃.